Bias Current Source ≲25nA

3 US Patents Issued & Proof of Silicon

Bias Current Sources with Positive Temperature Coefficient: This section contains a number of ultra-low-power (e.g., nano-ampere) “Proportional to Absolute Temperature” (PTAT) current sources (IPTAT), which have a positive temperature coefficient (TC) and can be fabricated in standard digital CMOS. IPTAT current sources are fundamental building blocks, generally providing a lifeline for other analog circuits (e.g., amplifiers, voltage references, ADCs, DACs, etc.). As such, Ai Analog offers numerous proprietary IPTAT intellectual property (IP) cells tailored to the different needs of other analog circuits they serve. These needs include less dependence on PMOSFETs vs. NMOSFETs, low operating VDD vs. low voltage coefficient, PTAT loops coupled to VDD or VSS, etc. The IPTAT circuits also include a start-up and power-off feature. Some of the common traits of IPTAT circuits are summarized below.

The intellectual property (IP) cells are generally portable from trailing-edge to bleeding-edge CMOS.

  • Tiny CMOS bias current cell with positive temperature coefficient (TC) operating in subthreshold with ultra-low current consumption (IDD).
  • Large value but tiny active bias resistor (RA) keeps IDD ultra-low.
  • IDD and IOUT absolute values are mostly a function of MOSFET mobility (µ), inherently more stable to help narrow IDD variation over fabrication process corners.
  • Diverting most leakages (of RA and key FETs) to supplies to improve the temperature range.
  • No clock, no switch-capacitor, and no related noise or injections into the substrate.
  • Narrow variations over manufacturing processes are also due to IDD and IOUT being less sensitive to VTH.
  • No passive resistors and no passive capacitors keep the area small and silicon cost low.
  • IOUT can be calibrated or trimmed for TC.
  • Programmable (pre- or post-silicon) IOUT that tracks IDD.
IBIAS3A - 91µm x 41µm
IBIAS3B - 64µm x 57µm
IBIAS3C - 110µm x 80µm
IBIAS4 - 48µm x 50µm
IBIAS5 - 62µm x 48µm
IBIAS8 - 61µm x 41µm
IBIAS9 - 60µm x 65µm
IBIAS9 - 60µm x 65µm
IBIAS9A - 60µm x 64µm
IBIAS10 - 80µm x 40µm
IBIAS11 - 68µm x 50µm
IBIAS11A - 68µm x 52µm
IBIAS12L - 90µm x 40µm
IBIAS13 - 60µm x 30µm
IBIAS14 - 45µm x 30µm

Bias Current Cell Table Summary

Proof of Silicon Preliminary Specifications (please see disclaimers)

Ibias Summary Table
Cell Name TSMC Fab Node Cell Size (µm × µm) VDD High (V) VDD Low (V) IDD (nA) +TC (%/C) +VC (%/V) Comments
IBIAS3A 180nm 94 × 41 2 0.8 9 0.5 0.5 Utilizes RPMOS, PTAT KCL coupled to VDD
IBIAS3B 180nm 64 × 57 2 0.8 7 0.3 0.4 Utilizes RPMOS, PTAT KCL coupled to VDD
IBIAS3C 180nm 110 × 80 2 0.8 7 0.6 0.3 Utilizes RPMOS, PTAT KCL coupled to VDD, Multiple IOUT ports
IBIAS4 180nm 48 × 50 2 0.7 6 0.5 0.5 Utilizes RPMOS, PTAT KCL coupled to VSS
IBIAS5 180nm 62 × 48 2 0.8 11 0.4 0.5 Utilizes RNMOS, PTAT KCL coupled to VSS
IBIAS8 180nm 60 × 40 2 0.9 7 0.5 0.3 Utilizes RPMOS, PTAT KCL coupled to VDD
IBIAS9 180nm 60 × 65 2 0.8 15 0.4 0.3 Utilizes RNMOS, PTAT KCL coupled to VSS
IBIAS9A 180nm 64 × 60 2 0.8 7 0.5 0.3 Utilizes RNMOS, PTAT KCL coupled to VSS
IBIAS10 180nm 80 × 40 2 0.8 19 0.3 0.4 Utilizes RNMOS, PTAT KCL coupled to VDD
IBIAS11 180nm 68 × 50 2 0.8 12 0.4 0.4 Utilizes RPMOS, PTAT KCL coupled to VSS
IBIAS11A 180nm 68 × 52 2 0.7 12 0.4 0.4 Utilizes RPMOS, PTAT KCL coupled to VSS
IBIAS12L 180nm 90 × 40 2 0.8 22 0.7 0.4 Utilizes RPMOS, PTAT KCL coupled to VDD
IBIAS13 65nm 60 × 30 1 0.6 10 0.6 0.5 Utilizes RNMOS, PTAT KCL coupled to VSS
IBIAS14 65nm 45 × 30 1 0.6 13 0.6 0.5 Utilizes RPMOS, PTAT KCL coupled to VDD